CMPD generates and manages in-process, transient materials property data used in process modeling and simulation. Our goal is to provide access to greater amounts of high-quality, pre-competitive data at substantially lower cost than stand-alone methods can provide.
- Member organizations benefit from shared expertise, collaborative quality assurance, and development and use of best practices for qualifying data needed for modeling materials.
- CMPD is member-driven and its portfolio of projects is determined by the industry membership.
- Our vision is to be the premiere platform for accessing pedigreed transient materials data for use as input to existing and new models.
CMPD Membership includes:
- Bi-annual workshop meetings
- Access to new and rare materials data
- Access to materials expertise at UConn, WPI, and UBuffalo
- An opportunity to select CMPD projects
CMPD Development and Focus Areas:
- Program development, outreach, industry education, and communications for collaborative projects
- Content structures and taxonomies for materials information
- Concept development, design, and implementation of materials data programs
- Materials data development, management, and networking
- Advanced modeling and characterization evaluation
Areas of Expertise Include:
- Advanced materials characterization methods
- Electron Microscopy (SEM, TEM, FIB, EBSD, in situ EM)
- Optical Microscopy (Zygo, metallography, petrography)
- Nano-scale characterization (hardness, stress-strain, modulus)
- Materials performance measurement (mechanical – fatigue, creep; electrochemical – corrosion)
- Rapid solidification: metallic glasses, additive manufacturing
- Deformation-driven phase transformations
- Computational thermodynamic and kinetic modeling
Types of Materials:
- Functional materials
- Electronic materials
- Light Metals (Al, Mg, Ti)
- Ferritic Metals
- Refractory Ceramics
Members have access to the vast resources available at our partner universities, as well as the data infrastructure and capabilities of ASM International.